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Copper Alloy C81300 vs Cu-ETP1

Copper Alloy · grade comparison

Copper Alloy C81300 and Cu-ETP1 are both copper alloy grades. C81300 is the stronger of the two: yield strength 172 MPa (24.9 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1, about 146% more; tensile strength follows at 310 MPa (45 ksi) vs 220 MPa (31.9 ksi). In exchange, Cu-ETP1 is the more ductile: elongation 40% versus 11% for C81300, and C81300 is harder (95 HB vs 45 HB). C81300 is stiffer (128 GPa vs 117 GPa) and C81300 runs hotter in service (350°C vs 200°C continuous). On the shop floor, C81300 welds better (good vs fair).

C81300Choose it when strength drives the design, or when the part sees heat.

Cu-ETP1Choose it when the part is bent, formed or impact-loaded.

C81300 vs Cu-ETP1: properties

C81300Cu-ETP1

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Elastic (Young's) Modulus

128 GPa18.6 Msi
117 GPa17 Msi

Shear Modulus

48 GPa7 Msi
44 GPa6.4 Msi

Bulk Modulus

130 GPa18.9 Msi
140 GPa20.3 Msi

Poisson's Ratio

0.3
0.34

Tensile Strength (Ultimate)

310 MPa45 ksi
220 MPa31.9 ksi

Yield Strength (0.2% offset)

172 MPa24.9 ksi
70 MPa10.2 ksi

Elongation at Break

11%
40%

Shear Strength

205 MPa29.7 ksi
150 MPa21.8 ksi

Fatigue Strength (Endurance Limit)

125 MPa18.1 ksi
75 MPa10.9 ksi

Hardness, Brinell

95 HB
45 HB

Hardness, Rockwell B

55 HRB
—

Reduction in Area

—
70%

Charpy V-Notch Impact (RT)

—
60 J44.3 ft·lbf

Hardness, Vickers

—
50 HV

Physical

Density and transition temperatures.

Density

8.83 g/cm³0.32 lb/in³
8.93 g/cm³0.32 lb/in³

Liquidus Temperature

1,080°C1,976 °F
1,083°C1,981 °F

Same in both: Melting Point (Solidus) 1,065°C1,949 °F

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

250 W/m·K144 BTU/hr·ft·°F
394 W/m·K228 BTU/hr·ft·°F

Specific Heat Capacity

376 J/kg·K0.09 BTU/lb·°F
385 J/kg·K0.09 BTU/lb·°F

Thermal Expansion (CTE, 20–100 °C)

17.6 µm/m·K9.8 µin/in·°F
17 µm/m·K9.4 µin/in·°F

Max Service Temperature (continuous)

350°C662 °F
200°C392 °F

Min Service Temperature

-200°C-328 °F
-250°C-418 °F

Same in both: Latent Heat of Fusion 205 J/g88.1 BTU/lb

Electrical

Conductivity and insulation.

Electrical Conductivity

60 % IACS
101.5 % IACS

Electrical Resistivity

2.87×10⁻⁸ Ω·m1.13 µΩ·in
1.7×10⁻⁸ Ω·m0.669 µΩ·in

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Galvanic Potential (seawater, vs SCE)

-0.2 V
-0.25 V

Corrosion Resistance

62 / 100
65 / 100

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Machinability

35 / 100
30 / 100

Weldability

60 / 100
50 / 100

Formability (cold)

25 / 100
95 / 100

Castability

70 / 100
45 / 100

Brazeability / Solderability

70 / 100
85 / 100

Polishability

75 / 100
80 / 100

Same in both: Machinability Rating (AISI 1212 = 100 %) 20%

Sustainability

Primary-production footprint per kilogram.

Embodied Energy (primary production)

58 MJ/kg24,936 BTU/lb
53 MJ/kg22,786 BTU/lb

Embodied Water

300 L/kg35.9 gal/lb
350 L/kg41.9 gal/lb

Typical Recycled Content

30%
10%

Same in both: Embodied Carbon (primary production) 3.6 kg CO₂/kg

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

35 kN·m/kg
25 kN·m/kg

Specific Stiffness (E / density)

14.5 MN·m/kg
13.1 MN·m/kg

Modulus of Resilience

116 kJ/m³
21 kJ/m³

Thermal Diffusivity

75.3 mm²/s
114.6 mm²/s

Thermal Shock Resistance Index

34
44

Strength versus weight

Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleCu-ETP1C81300

Manufacturing and finishing

CapabilityC81300Cu-ETP1
Default condition——
Relative cost$$$$ High$$$$ High
Min. machined wall——
Best machined surface——

Both take the same 4 finishes: Copper Plating, Electroless Nickel (EN), Gold Plating, Silver Plating.

C81300 vs Cu-ETP1 — frequently asked

Is C81300 stronger than Cu-ETP1?

Yes. C81300 has a typical yield strength of 172 MPa (24.9 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1 — about 146% more. Tensile strength is 310 MPa (45 ksi) vs 220 MPa (31.9 ksi).

Which is cheaper, C81300 or Cu-ETP1?

Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.

Which is easier to machine, C81300 or Cu-ETP1?

C81300. Its machinability rates fair (35/100) against poor (30/100) for Cu-ETP1; for welding the order is C81300 first (good, 60/100) then Cu-ETP1 (fair, 50/100).

Ready to make it?

Upload a CAD file and FabDigit prices the part in C81300 and Cu-ETP1 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.