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PC-FR · print state

PC-FR 3DP-FIL

Properties of the 3DP-FIL condition, compared with the other PC-FR grades.

Pick when the flame-retardant part is FDM-printed: use for enclosures, jigs and rail/aero interior prototypes; expect anisotropy and lower elongation than molded PC.

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Request a quote in PC-FR 3DP-FILPC-FR overview

What is PC-FR 3DP-FIL?

PC-FR 3DP-FIL is PC-FR in the 3DP-FIL condition — pick when the flame-retardant part is FDM-printed: use for enclosures, jigs and rail/aero interior prototypes; expect anisotropy and lower elongation than molded PC. PC-FR 3DP-FIL has a yield strength of 52 MPa (7.54 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 52% of polymer grades. Elongation at break is 6% and the elastic modulus is 2.1 GPa (0.305 Msi). PC-FR 3DP-FIL has a density of 1.21 g/cm³ (0.0437 lb/in³), heavier than 59% of polymer grades. Its glass-transition temperature is 147°C (297 °F). V0 is the default condition FabDigit quotes; 3DP-FIL is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 75/100, better than 86% of polymer grades

Limitations

  • Needs corrosion protection — 60/100, worse than 91% of polymer grades

PC-FR 3DP-FIL properties

Typical room-temperature values for PC-FR 3DP-FIL — 15 properties are specific to this condition; the rest are grade-level values shared by every PC-FR grade. Each bar shows where the value sits among the polymer grades in FabDigit's library — further right is higher.

Physical5

PC-FR 3DP-FIL has a density of 1.21 g/cm³ (0.0437 lb/in³), heavier than 59% of polymer grades. Its glass-transition temperature is 147°C (297 °F).

Density1.21 g/cm³0.04 lb/in³
Glass Transition (Tg)147°C297 °F
Water Absorption (24 h)0.15%
Water Absorption (Saturation)0.35%
Refractive Index1.586

Mechanical17

PC-FR 3DP-FIL has a yield strength of 52 MPa (7.54 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 52% of polymer grades. Elongation at break is 6% and the elastic modulus is 2.1 GPa (0.305 Msi).

Elastic (Young's) Modulus2.1 GPa0.3 Msi
Shear Modulus0.85 GPa0.12 Msi
Bulk Modulus4 GPa0.55 Msi
Poisson's Ratio0.39
Tensile Strength (Ultimate)55 MPa8 ksi
Yield Strength (0.2% offset)52 MPa7.5 ksi
Elongation at Break6%
Compressive Strength80 MPa11.6 ksi
Compressive Modulus2.3 GPa0.33 Msi
Flexural Strength85 MPa12.3 ksi
Flexural Modulus2.1 GPa0.3 Msi
Shear Strength62 MPa9 ksi
Fracture Toughness (K_IC)2.6 MPa·√m2.4 ksi·√in
Izod Impact, Notched150 J/m2.8 ft·lbf/in
Hardness, Shore D81 Shore D
Hardness, Rockwell M72 HRM
Hardness, Rockwell R120 HRR

Thermal11

PC-FR 3DP-FIL is rated for continuous service to 120°C (248 °F). It conducts heat at 0.2 W/m·K (0.116 BTU/hr·ft·°F), worse than 56% of polymer grades. Thermal expansion is 67 µm/m·K (37.2 µin/in·°F).

Thermal Conductivity0.2 W/m·K0.12 BTU/hr·ft·°F
Specific Heat Capacity1,200 J/kg·K0.29 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)67 µm/m·K37.2 µin/in·°F
Max Service Temperature (continuous)120°C248 °F
Min Service Temperature-40°C-40 °F
Heat Deflection Temp. @ 0.45 MPa140°C284 °F
Heat Deflection Temp. @ 1.8 MPa125°C257 °F
Vicat Softening Point (B50)145°C293 °F
Flammability (UL 94)V-0 typically declared at 1.5–3.0 mm on solid (100% infill) printed specimens; rating not valid for sparse-infill walls
Limiting Oxygen Index33%
Max Service Temperature (short-term)140°C284 °F

Electrical7

PC-FR 3DP-FIL is an electrical insulator with a dielectric strength of 20 kV/mm (508 V/mil) and a resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Strength20 kV/mm508 V/mil
Dielectric Constant (1 MHz)2.95
Dissipation Factor (1 MHz)0.01
Volume Resistivity1×10¹⁶ Ω·cm
Surface Resistivity1×10¹⁵ Ω
Comparative Tracking Index (CTI)250 V

Chemical & Environmental3

Corrosion resistance is good (60/100), worse than 91% of polymer grades. UV resistance is fair.

Corrosion ResistanceGood60/100
UV / Weathering ResistanceFair40/100
Chemical Resistance SummaryGood vs water, dilute acids, aliphatic hydrocarbons, oils; poor vs alkalis, ammonia, amines, ketones, esters, chlorinated/aromatic solvents; highly notch- and stress-crack sensitive; hydrolysis above ~60 °C in hot water/steam.

Sustainability4

Producing a kilogram of PC-FR 3DP-FIL takes about 110 MJ of energy and emits 6.6 kg of CO₂ — more than 64% of polymer grades. Typical recycled content is 5%.

Embodied Energy (primary production)110 MJ/kg47,292 BTU/lb
Embodied Carbon (primary production)6.6 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content5%

Manufacturability8

PC-FR 3DP-FIL's machinability is good (60/100, better than 51% of polymer grades); weldability fair (50/100); formability good (60/100).

MachinabilityGood60/100
WeldabilityFair50/100
Formability (cold)Good60/100
PolishabilityVery good75/100
Mold Shrinkage0.6%
Melt Flow Rate10 g/10 min
Processing Melt Temperature (typ.)285°C545 °F
Mold Temperature (typ.)110°C230 °F

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Other PC-FR grades and fills

PC-FR is also supplied in 11 other conditions. The full side-by-side table is on the PC-FR overview.

Working with PC-FR 3DP-FIL

Is PC-FR easy to machine?

Machines cleanly with sharp positive-rake carbide tools, high speed / light feed and air cooling; avoid water-soluble coolants and anneal 120 °C to prevent stress cracking around holes.

Can PC-FR be welded?

Ultrasonic, hot-plate, laser and IR welding all work; solvent bonding with dichloromethane blends or UV/cyanoacrylate adhesives — never use ammonia- or amine-based cleaners.

Can PC-FR be formed, bent or molded?

Dry 4 h at 120 °C (<0.02% moisture), melt 270–305 °C, mold 70–110 °C, generous radii and 0.5–1.5° draft; for FDM print at 265–305 °C nozzle with 100–130 °C chamber/bed, PVP/PC-adhesive plate and enclosure to stop warping.

What surface finishes work on PC-FR?

Paints and hard-coats adhere well after IPA wipe (no aggressive solvents); vacuum metallizing and EMI conductive coatings common; polishing or vapor smoothing is limited — better to mold/print a gloss surface.

PC-FR chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
organophosphate / phosphazene flame retanon-halogen types (BDP/RDP) or potassium sulfonate salts (KSS) in transparent grades2 – 84
PTFE anti-drip agentfibrillating PTFE for drip suppression0.1 – 0.70.35
heat/hydrolysis stabilizer + mold releasphosphite antioxidant, epoxy acid scavenger, PETS release0.1 – 0.80.3
pigment / UV absorberTiO2 or carbon black + benzotriazole/triazine UVA in weatherable grades0 – 20.5
bisphenol-A polycarbonate resinlinear BPA-PC, Mw ~22,000–30,000≥ 88 (balance)—

PC-FR 3DP-FIL — frequently asked

What is PC-FR 3DP-FIL used for?

PC-FR 3DP-FIL is typically used for aircraft interiors, rail components and electrical housings. In short: flame-retardant PC (V-0 class).

What is the yield strength of PC-FR 3DP-FIL?

PC-FR 3DP-FIL has a typical yield strength of 52 MPa (7.54 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 52% of polymer grades. Strength varies by condition: see the 12 listed tempers.

Is PC-FR 3DP-FIL easy to machine?

Reasonably — machinability is rated good (60/100, better than 51% of polymer grades). Machines cleanly with sharp positive-rake carbide tools, high speed / light feed and air cooling; avoid water-soluble coolants and anneal 120 °C to prevent stress cracking around holes.

Can PC-FR 3DP-FIL be welded?

With care — weldability is rated fair (50/100). Ultrasonic, hot-plate, laser and IR welding all work; solvent bonding with dichloromethane blends or UV/cyanoacrylate adhesives — never use ammonia- or amine-based cleaners.

What surface finishes work on PC-FR 3DP-FIL?

Paints and hard-coats adhere well after IPA wipe (no aggressive solvents); vacuum metallizing and EMI conductive coatings common; polishing or vapor smoothing is limited — better to mold/print a gloss surface.

Can PC-FR 3DP-FIL be formed, bent or molded?

Dry 4 h at 120 °C (<0.02% moisture), melt 270–305 °C, mold 70–110 °C, generous radii and 0.5–1.5° draft; for FDM print at 265–305 °C nozzle with 100–130 °C chamber/bed, PVP/PC-adhesive plate and enclosure to stop warping.

What is the maximum service temperature of PC-FR 3DP-FIL?

PC-FR 3DP-FIL is rated for continuous use to about 120°C (248 °F), and briefly to 140°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between PC-FR-V0 and PC-FR 3DP-FIL?

V0 is the default condition — default choice for electrical enclosures and housings needing V-0 with full PC toughness. 3DP-FIL: pick when the flame-retardant part is FDM-printed: use for enclosures, jigs and rail/aero interior prototypes; expect anisotropy and lower elongation than molded PC. Yield strength is 62 MPa in V0 versus 52 MPa in 3DP-FIL.

Can FabDigit make parts in PC-FR 3DP-FIL?

Yes — PC-FR 3DP-FIL is available for 3D printing with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. Makrolon 6265/6555 & Bayblend FR flame-retardant PC datasheets — Covestro (2023)
  2. LEXAN resin 940A/945A/FR grades product data — SABIC (2023)
  3. CAMPUS plastics database — PC FR injection grades (ISO 10350 data sets) — CWFG/CAMPUS (2024)
  4. Engineered Materials Handbook Vol. 2: Engineering Plastics — ASM International (1988)
  5. UL 94 Standard for Tests for Flammability of Plastic Materials — UL Solutions (2021)
  6. PC-FR / PC-ISO FDM filament technical data — Stratasys / Polymaker / eSUN (2024)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.