Boron Nitride HP-99
Grade
also Hex Boron Nitride, White Graphite
HP-99 = high-purity (>99 %) binder-free hot-pressed hBN
Choose for semiconductor, crystal-growth and vacuum-furnace parts where boron-oxide outgassing, moisture pickup or metal-ion contamination cannot be tolerated.
Values for the HP-99 condition
Other Boron Nitride tempers and conditions
Boron Nitride is listed in 8 conditions; see the grade overview at Boron Nitride.
Compare all 8 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
HP-99This page High-purity (>99 %) binder-free hot-pressed hBN | Choose for semiconductor, crystal-growth and vacuum-furnace parts where boron-oxide outgassing, moisture pickup or metal-ion contamination cannot be tolerated. | 25 | 60 W/m·K | |||
Grade XP | High-purity fine-grain hot-pressed hBN with low binder content — clean, low-outgassing and near-isotropic, for crucibles, insulators and semiconductor fixtures. | 30 | 40 W/m·K | |||
Pressed & SinteredDefault hot-pressed hBN with boric-oxide bond (Grade A type) | General-purpose machinable hBN block/rod for molten-metal contact, insulators and break rings; cheapest route, but the B2O3 bond is hygroscopic. | 35 | 33 W/m·K | |||
Grade BO | Hot-pressed hexagonal BN with boric-oxide (B₂O₃) bond — high strength and excellent machinability, but hygroscopic and limited to moderate air temperatures. | 35 | 27 W/m·K | |||
Grade CA | Calcium-borate bonded hot-pressed hBN — moisture-resistant version of bonded BN with higher strength and service to ~1000 °C in air. | 45 | 25 W/m·K | |||
BN-SiO₂ | Choose when strength, wear and non-hygroscopic behaviour matter more than maximum thermal conductivity — jigs, nozzles, high-humidity or load-bearing insulators. | 50 | 25 W/m·K | |||
Pyrolytic boron nitride | Choose for MBE effusion-cell crucibles, GaAs/InP growth boats and microwave-tube windows: pore-free, ultra-pure, no binder, usable to ~1800 °C in vacuum. | 100 | 60 W/m·K | |||
Cubic boron nitride, sintered polycrystalline | Choose only as a superhard cutting/wear material: second only to diamond in hardness and, unlike diamond, chemically stable against ferrous alloys up to ~1000 °C. | 4,000 HV | 200 W/m·K |
What is Boron Nitride HP-99?
Boron Nitride HP-99 is Boron Nitride in the HP-99 grade — choose for semiconductor, crystal-growth and vacuum-furnace parts where boron-oxide outgassing, moisture pickup or metal-ion contamination cannot be tolerated. Boron Nitride HP-99 has a tensile strength of 25 MPa (3.63 ksi), weaker than 85% of ceramic grades. The elastic modulus is 40 GPa (5.8 Msi). Boron Nitride HP-99 has a density of 1.9 g/cm³ (0.0686 lb/in³), lighter than 88% of ceramic grades. It melts at 2,973°C (5,383 °F). Pressed & Sintered is the default condition FabDigit quotes; HP-99 is available on request or by drawing note.
Advantages
- Easy to machine — 90/100, better than 94% of ceramic grades
- Lightweight — 1.9 g/cm³ (0.0686 lb/in³), better than 88% of ceramic grades
Limitations
- Hard to polish — 25/100, worse than 97% of ceramic grades
- Low stiffness — 40 GPa (5.8 Msi), worse than 85% of ceramic grades
- Low fracture toughness — 1 MPa·√m (0.91 ksi·√in), worse than 84% of ceramic grades
Boron Nitride HP-99 properties
Typical room-temperature values for Boron Nitride HP-99; 13 are specific to this condition. Other listed values are Boron Nitride reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical4
Boron Nitride HP-99 has a density of 1.9 g/cm³ (0.0686 lb/in³), lighter than 88% of ceramic grades. It melts at 2,973°C (5,383 °F).
Mechanical9
Boron Nitride HP-99 has a tensile strength of 25 MPa (3.63 ksi), weaker than 85% of ceramic grades. The elastic modulus is 40 GPa (5.8 Msi).
Thermal5
Boron Nitride HP-99 is rated for continuous service to 1,000°C (1,832 °F). It conducts heat at 60 W/m·K (34.7 BTU/hr·ft·°F), better than 70% of ceramic grades. Thermal expansion is 2 µm/m·K (1.11 µin/in·°F).
Electrical5
Boron Nitride HP-99 is an electrical insulator with a dielectric strength of 55 kV/mm (1,397 V/mil) and a resistivity of 1×10¹⁴ Ω·m.
Chemical & Environmental2
Corrosion resistance is very good (80/100), better than 56% of ceramic grades.
Sustainability4
Producing a kilogram of Boron Nitride HP-99 takes about 250 MJ of energy and emits 20 kg of CO₂ — more than 67% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
Boron Nitride HP-99's machinability is excellent (90/100, better than 94% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Boron Nitride HP-99
Is Boron Nitride easy to machine?
Machines like hard chalk — turn, mill, drill and tap dry with sharp carbide or HSS tooling at high speed and low feed; use dust extraction and avoid water coolant on B2O3-bonded grades.
Can Boron Nitride be welded?
Not weldable; join by mechanical clamping, threaded/pinned assemblies, or high-temperature BN/alumina cements and metallized-then-brazed interfaces.
Can Boron Nitride be formed, bent or molded?
Made by uniaxial hot pressing or CIP + pressureless nitridation of hBN powder into billets, then finish machined; PBN is grown as free-standing CVD shells on graphite mandrels, cBN is HP/HIP-sintered at GPa pressures.
What surface finishes work on Boron Nitride?
No plating or anodizing; surfaces are lightly ground or lapped only, remain matte and can leave a lubricious film — bake parts at 200–500 °C in vacuum/inert before high-temperature or vacuum service to drive off absorbed moisture.
Boron Nitride chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Bstoichiometric BN | 42 – 44 | 43.6 |
| B2O3boric-oxide bond phase in pressed & sintered grades; <0.5 % in high-purity and PBN grades | 0 – 6 | 3 |
| SiO2only in BN-SiO2 composite grades (borosilicate/calcium-borate bond) | 0 – 40 | 0 |
| CaOoptional calcium-borate bond addition | 0 – 5 | 0 |
| Nstoichiometric BN | balance |
Boron Nitride HP-99 — frequently asked
What is Boron Nitride HP-99 used for?
Boron Nitride HP-99 is typically used for crucibles for molten metal, electrical insulators and feedthroughs, break rings for horizontal continuous casting, mould release and setter plates, thermocouple protection sleeves and plasma chamber insulators. In short: machinable thermal insulator.
What is the tensile strength of Boron Nitride HP-99?
Boron Nitride HP-99 has a typical tensile strength of 25 MPa (3.63 ksi) — weaker than 85% of ceramic grades. Strength varies by condition: see the 8 listed tempers.
Is Boron Nitride HP-99 easy to machine?
Yes — machinability is rated excellent (90/100, better than 94% of ceramic grades). Machines like hard chalk — turn, mill, drill and tap dry with sharp carbide or HSS tooling at high speed and low feed; use dust extraction and avoid water coolant on B2O3-bonded grades.
Can Boron Nitride HP-99 be welded?
Not weldable; join by mechanical clamping, threaded/pinned assemblies, or high-temperature BN/alumina cements and metallized-then-brazed interfaces.
What surface finishes work on Boron Nitride HP-99?
No plating or anodizing; surfaces are lightly ground or lapped only, remain matte and can leave a lubricious film — bake parts at 200–500 °C in vacuum/inert before high-temperature or vacuum service to drive off absorbed moisture.
Can Boron Nitride HP-99 be formed, bent or molded?
Made by uniaxial hot pressing or CIP + pressureless nitridation of hBN powder into billets, then finish machined; PBN is grown as free-standing CVD shells on graphite mandrels, cBN is HP/HIP-sintered at GPa pressures.
What is the maximum service temperature of Boron Nitride HP-99?
Boron Nitride HP-99 is rated for continuous use to about 1,000°C (1,832 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASM Engineered Materials Handbook, Vol. 4: Ceramics and Glasses — ASM International (1991)
- Combat Boron Nitride Solids — Grades A, AX05, M, HP — Momentive Performance Materials / Saint-Gobain (2021)
- Boron Nitride Machinable Ceramics and PBN Crucibles — Kennametal / CoorsTek / Shin-Etsu (2022)
- Boron nitride (hexagonal, pyrolytic, cubic) property records — MatWeb / Ceramic Industry Materials Handbook (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.