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PI · grade

PI FILM

Properties of the FILM condition, compared with the other PI grades.

Pick for flexible circuits, cable/motor insulation, thermal tape and high-voltage barriers where thin, tough, high-dielectric film is needed.

What is PI FILM?

PI FILM is PI in the FILM grade — pick for flexible circuits, cable/motor insulation, thermal tape and high-voltage barriers where thin, tough, high-dielectric film is needed. PI FILM has a tensile strength of 231 MPa (33.5 ksi), stronger than 99% of polymer grades. Elongation at break is 72% and the elastic modulus is 2.5 GPa (0.363 Msi). PI FILM has a density of 1.42 g/cm³ (0.0513 lb/in³), heavier than 82% of polymer grades. Its glass-transition temperature is 385°C (725 °F). Unfilled is the default condition FabDigit quotes; FILM is available on request or by drawing note.

Advantages

  • High service temperature — 260°C (500 °F), better than 97% of polymer grades
  • Good UV / weathering resistance — 60/100, better than 80% of polymer grades

Limitations

  • Absorbs moisture — dry before molding — 1.8%, worse than 95% of polymer grades
  • High embodied carbon — 13 kg CO₂/kg, worse than 93% of polymer grades
  • Difficult to weld — 5/100, worse than 90% of polymer grades
  • Heavy — 1.42 g/cm³ (0.0513 lb/in³), worse than 82% of polymer grades
  • Poor heat conductor — 0.12 W/m·K (0.0693 BTU/hr·ft·°F), worse than 82% of polymer grades

PI FILM properties

Typical room-temperature values for PI FILM — 14 properties are specific to this condition; the rest are grade-level values shared by every PI grade. Each bar shows where the value sits among the polymer grades in FabDigit's library — further right is higher.

Physical5

PI FILM has a density of 1.42 g/cm³ (0.0513 lb/in³), heavier than 82% of polymer grades. Its glass-transition temperature is 385°C (725 °F).

Density1.42 g/cm³0.05 lb/in³
Glass Transition (Tg)385°C725 °F
Water Absorption (24 h)1.8%
Water Absorption (Saturation)1.2%
Refractive Index1.7

Mechanical15

PI FILM has a tensile strength of 231 MPa (33.5 ksi), stronger than 99% of polymer grades. Elongation at break is 72% and the elastic modulus is 2.5 GPa (0.363 Msi).

Elastic (Young's) Modulus2.5 GPa0.36 Msi
Shear Modulus1.1 GPa0.16 Msi
Bulk Modulus6 GPa0.8 Msi
Poisson's Ratio0.41
Tensile Strength (Ultimate)231 MPa33.5 ksi
Elongation at Break72%
Compressive Strength130 MPa18.9 ksi
Compressive Modulus2.9 GPa0.42 Msi
Flexural Strength110 MPa16 ksi
Flexural Modulus3.1 GPa0.45 Msi
Shear Strength80 MPa11.6 ksi
Fracture Toughness (K_IC)2 MPa·√m1.8 ksi·√in
Izod Impact, Notched43 J/m0.81 ft·lbf/in
Hardness, Shore D88 Shore D
Hardness, Rockwell M105 HRM

Thermal10

PI FILM is rated for continuous service to 260°C (500 °F). It conducts heat at 0.12 W/m·K (0.0693 BTU/hr·ft·°F), worse than 82% of polymer grades. Thermal expansion is 20 µm/m·K (11.1 µin/in·°F).

Thermal Conductivity0.12 W/m·K0.07 BTU/hr·ft·°F
Specific Heat Capacity1,130 J/kg·K0.27 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)20 µm/m·K11.1 µin/in·°F
Max Service Temperature (continuous)260°C500 °F
Min Service Temperature-240°C-400 °F
Heat Deflection Temp. @ 0.45 MPa400°C752 °F
Heat Deflection Temp. @ 1.8 MPa360°C680 °F
Flammability (UL 94)V-0 / VTM-0 for thin film
Limiting Oxygen Index45%
Max Service Temperature (short-term)400°C752 °F

Electrical6

PI FILM is an electrical insulator with a dielectric strength of 300 kV/mm (7,620 V/mil) and a resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Strength300 kV/mm7,620 V/mil
Dielectric Constant (1 MHz)3.4
Dissipation Factor (1 MHz)0.0018
Volume Resistivity1.5×10¹⁷ Ω·cm
Surface Resistivity1×10¹⁵ Ω

Chemical & Environmental3

Corrosion resistance is excellent (85/100), better than 63% of polymer grades. UV resistance is good.

Corrosion ResistanceExcellent85/100
UV / Weathering ResistanceGood60/100
Chemical Resistance SummaryExcellent against hydrocarbons, ketones, esters, aromatic/chlorinated solvents, oils, fuels, radiation and high vacuum; attacked by strong bases (NaOH, ammonia), hydrazine, concentrated acids and long-term hot water/steam (hydrolysis of the imide ring).

Sustainability4

Producing a kilogram of PI FILM takes about 290 MJ of energy and emits 13 kg of CO₂ — more than 95% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)290 MJ/kg124,678 BTU/lb
Embodied Carbon (primary production)13 kg CO₂/kg
Embodied Water600 L/kg71.9 gal/lb
Typical Recycled Content0%

Manufacturability4

PI FILM's machinability is good (65/100, better than 66% of polymer grades); weldability not recommended (5/100); formability poor (15/100).

MachinabilityGood65/100
WeldabilityNot recommended5/100
Formability (cold)Poor15/100
PolishabilityGood60/100

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Other PI grades and fills

PI is also supplied in 7 other conditions. The full side-by-side table is on the PI overview.

Working with PI FILM

Is PI easy to machine?

Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI be welded?

Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

Can PI be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What surface finishes work on PI?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

PI chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
graphite15 % in SP-21, 40 % in SP-220 – 400
PTFE10 % in SP-2110 – 100
MoS215 % in SP-3 (vacuum grade)0 – 150
carbon fiberstructural CF-reinforced grades0 – 400
polyimide resin (PMDA–ODA type aromatic pyromellitic dianhydride + 4,4'-oxydianiline backbone; unfilled default gradebalance

PI FILM — frequently asked

What is PI FILM used for?

PI FILM is typically used for wire and cable insulation film, aerospace and satellite structural parts, unlubricated bushings and thrust washers, seal rings and piston rings for high-temperature service, semiconductor process components and flexible circuit substrates. In short: ultimate aerospace performance.

What is the tensile strength of PI FILM?

PI FILM has a typical tensile strength of 231 MPa (33.5 ksi) — stronger than 99% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is PI FILM easy to machine?

Reasonably — machinability is rated good (65/100, better than 66% of polymer grades). Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI FILM be welded?

Not readily — weldability is rated not recommended (5/100). Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

What surface finishes work on PI FILM?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

Can PI FILM be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What is the maximum service temperature of PI FILM?

PI FILM is rated for continuous use to about 260°C (500 °F), and briefly to 400°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Can FabDigit make parts in PI FILM?

Yes — PI FILM is available for CNC machining, sheet metal and injection molding with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. Vespel SP-1 / SP-21 / SP-22 / SP-211 / SP-3 polyimide parts and shapes design handbookDuPont (2021)
  2. Kapton HN polyimide film — summary of propertiesDuPont (2022)
  3. Duratron PI / CU60 polyimide stock shapes datasheetMitsubishi Chemical Advanced Materials (2022)
  4. Meldin 7001 / 7211 / 7220 polyimide datasheetsSaint-Gobain Performance Plastics (2021)
  5. AURUM thermoplastic polyimide product guideMitsui Chemicals (2020)
  6. Engineered Materials Handbook Vol. 2: Engineering PlasticsASM International (1988)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.