FabDigitFabDigit

Copper Alloy C82500 vs Cu-ETP1

Copper Alloy · grade comparison

Copper Alloy C82500 and Cu-ETP1 are both copper alloy grades. C82500 is the stronger of the two: yield strength 1,000 MPa (145 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1, about 14 times as much; tensile strength follows at 1,105 MPa (160 ksi) vs 220 MPa (31.9 ksi). In exchange, Cu-ETP1 is the more ductile: elongation 40% versus 1% for C82500, and C82500 is harder (375 HB vs 45 HB). C82500 is lighter (8.26 g/cm³ vs 8.93 g/cm³ for Cu-ETP1) and C82500 is stiffer (128 GPa vs 117 GPa). On the shop floor, Cu-ETP1 welds better (50 vs 40 out of 100).

C82500Choose it when strength drives the design, or when weight is the constraint.

Cu-ETP1Choose it when the part is bent, formed or impact-loaded, or when it will be welded.

C82500 vs Cu-ETP1: properties

C82500Cu-ETP1

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Elastic (Young's) Modulus

128 GPa18.6 Msi
117 GPa17 Msi

Shear Modulus

50 GPa7.3 Msi
44 GPa6.4 Msi

Bulk Modulus

115 GPa16.7 Msi
140 GPa20.3 Msi

Poisson's Ratio

0.3
0.34

Tensile Strength (Ultimate)

1,105 MPa160 ksi
220 MPa31.9 ksi

Yield Strength (0.2% offset)

1,000 MPa145 ksi
70 MPa10.2 ksi

Elongation at Break

1%
40%

Reduction in Area

2%
70%

Compressive Strength

1,240 MPa180 ksi
—

Shear Strength

690 MPa100 ksi
150 MPa21.8 ksi

Fatigue Strength (Endurance Limit)

230 MPa33.4 ksi
75 MPa10.9 ksi

Charpy V-Notch Impact (RT)

5 J3.7 ft·lbf
60 J44.3 ft·lbf

Hardness, Brinell

375 HB
45 HB

Hardness, Rockwell C

40 HRC
—

Hardness, Vickers

400 HV
50 HV

Physical

Density and transition temperatures.

Density

8.26 g/cm³0.3 lb/in³
8.93 g/cm³0.32 lb/in³

Melting Point (Solidus)

857°C1,575 °F
1,065°C1,949 °F

Liquidus Temperature

982°C1,800 °F
1,083°C1,981 °F

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

105 W/m·K60.7 BTU/hr·ft·°F
394 W/m·K228 BTU/hr·ft·°F

Specific Heat Capacity

419 J/kg·K0.1 BTU/lb·°F
385 J/kg·K0.09 BTU/lb·°F

Max Service Temperature (continuous)

250°C482 °F
200°C392 °F

Min Service Temperature

-200°C-328 °F
-250°C-418 °F

Same in both: Thermal Expansion (CTE, 20–100 °C) 17 µm/m·K9.4 µin/in·°F · Latent Heat of Fusion 205 J/g88.1 BTU/lb

Electrical

Conductivity and insulation.

Electrical Conductivity

20 % IACS
101.5 % IACS

Electrical Resistivity

8.6×10⁻⁸ Ω·m3.39 µΩ·in
1.7×10⁻⁸ Ω·m0.669 µΩ·in

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Corrosion Resistance

62 / 100
65 / 100

Same in both: Galvanic Potential (seawater, vs SCE) -0.25 V

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Machinability

35 / 100
30 / 100

Weldability

40 / 100
50 / 100

Formability (cold)

10 / 100
95 / 100

Castability

75 / 100
45 / 100

Brazeability / Solderability

65 / 100
85 / 100

Polishability

85 / 100
80 / 100

Same in both: Machinability Rating (AISI 1212 = 100 %) 20%

Sustainability

Primary-production footprint per kilogram.

Embodied Energy (primary production)

130 MJ/kg55,890 BTU/lb
53 MJ/kg22,786 BTU/lb

Embodied Carbon (primary production)

8.5 kg CO₂/kg
3.6 kg CO₂/kg

Embodied Water

250 L/kg30 gal/lb
350 L/kg41.9 gal/lb

Typical Recycled Content

30%
10%

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

134 kN·m/kg
25 kN·m/kg

Specific Stiffness (E / density)

15.5 MN·m/kg
13.1 MN·m/kg

Modulus of Resilience

3,906 kJ/m³
21 kJ/m³

Thermal Diffusivity

30.3 mm²/s
114.6 mm²/s

Thermal Shock Resistance Index

53
44

Strength versus weight

Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleCu-ETP1C82500

Manufacturing and finishing

CapabilityC82500Cu-ETP1
Default condition——
Relative cost$$$$ High$$$$ High
Min. machined wall——
Best machined surface——

Both take the same 4 finishes: Copper Plating, Electroless Nickel (EN), Gold Plating, Silver Plating.

C82500 vs Cu-ETP1 — frequently asked

Is C82500 stronger than Cu-ETP1?

Yes. C82500 has a typical yield strength of 1,000 MPa (145 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1 — about 14 times as much. Tensile strength is 1,105 MPa (160 ksi) vs 220 MPa (31.9 ksi).

Which is cheaper, C82500 or Cu-ETP1?

Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.

Which is easier to machine, C82500 or Cu-ETP1?

C82500. Its machinability rates fair (35/100) against poor (30/100) for Cu-ETP1; for welding the order is Cu-ETP1 first (fair, 50/100) then C82500 (fair, 40/100).

Ready to make it?

Upload a CAD file and FabDigit prices the part in C82500 and Cu-ETP1 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.