FabDigitFabDigit

Copper Alloy C82000 vs Cu-ETP1

Copper Alloy · grade comparison

Copper Alloy C82000 and Cu-ETP1 are both copper alloy grades. C82000 is the stronger of the two: yield strength 500 MPa (72.5 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1, about 7.1 times as much; tensile strength follows at 655 MPa (95 ksi) vs 220 MPa (31.9 ksi). In exchange, Cu-ETP1 is the more ductile: elongation 40% versus 5% for C82000, and C82000 is harder (210 HB vs 45 HB). C82000 is lighter (8.61 g/cm³ vs 8.93 g/cm³ for Cu-ETP1) and C82000 is stiffer (138 GPa vs 117 GPa). On the shop floor, Cu-ETP1 welds better (50 vs 40 out of 100).

C82000Choose it when strength drives the design, or when weight is the constraint.

Cu-ETP1Choose it when the part is bent, formed or impact-loaded, or when it will be welded.

C82000 vs Cu-ETP1: properties

C82000Cu-ETP1

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Elastic (Young's) Modulus

138 GPa20 Msi
117 GPa17 Msi

Shear Modulus

53 GPa7.7 Msi
44 GPa6.4 Msi

Bulk Modulus

115 GPa16.7 Msi
140 GPa20.3 Msi

Poisson's Ratio

0.3
0.34

Tensile Strength (Ultimate)

655 MPa95 ksi
220 MPa31.9 ksi

Yield Strength (0.2% offset)

500 MPa72.5 ksi
70 MPa10.2 ksi

Elongation at Break

5%
40%

Compressive Strength

520 MPa75.4 ksi
—

Shear Strength

440 MPa63.8 ksi
150 MPa21.8 ksi

Fatigue Strength (Endurance Limit)

185 MPa26.8 ksi
75 MPa10.9 ksi

Charpy V-Notch Impact (RT)

11 J8.1 ft·lbf
60 J44.3 ft·lbf

Hardness, Brinell

210 HB
45 HB

Hardness, Rockwell B

96 HRB
—

Hardness, Rockwell C

22 HRC
—

Reduction in Area

—
70%

Hardness, Vickers

—
50 HV

Physical

Density and transition temperatures.

Density

8.61 g/cm³0.31 lb/in³
8.93 g/cm³0.32 lb/in³

Melting Point (Solidus)

1,038°C1,900 °F
1,065°C1,949 °F

Liquidus Temperature

1,068°C1,954 °F
1,083°C1,981 °F

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

190 W/m·K110 BTU/hr·ft·°F
394 W/m·K228 BTU/hr·ft·°F

Specific Heat Capacity

419 J/kg·K0.1 BTU/lb·°F
385 J/kg·K0.09 BTU/lb·°F

Thermal Expansion (CTE, 20–100 °C)

17.8 µm/m·K9.9 µin/in·°F
17 µm/m·K9.4 µin/in·°F

Max Service Temperature (continuous)

230°C446 °F
200°C392 °F

Min Service Temperature

-200°C-328 °F
-250°C-418 °F

Same in both: Latent Heat of Fusion 205 J/g88.1 BTU/lb

Electrical

Conductivity and insulation.

Electrical Conductivity

48 % IACS
101.5 % IACS

Electrical Resistivity

3.6×10⁻⁸ Ω·m1.42 µΩ·in
1.7×10⁻⁸ Ω·m0.669 µΩ·in

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Same in both: Galvanic Potential (seawater, vs SCE) -0.25 V · Corrosion Resistance 65 / 100

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Machinability

25 / 100
30 / 100

Weldability

40 / 100
50 / 100

Formability (cold)

15 / 100
95 / 100

Castability

75 / 100
45 / 100

Brazeability / Solderability

60 / 100
85 / 100

Same in both: Machinability Rating (AISI 1212 = 100 %) 20% · Polishability 80 / 100

Sustainability

Primary-production footprint per kilogram.

Embodied Energy (primary production)

95 MJ/kg40,843 BTU/lb
53 MJ/kg22,786 BTU/lb

Embodied Carbon (primary production)

6.5 kg CO₂/kg
3.6 kg CO₂/kg

Typical Recycled Content

30%
10%

Same in both: Embodied Water 350 L/kg41.9 gal/lb

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

76 kN·m/kg
25 kN·m/kg

Specific Stiffness (E / density)

16 MN·m/kg
13.1 MN·m/kg

Modulus of Resilience

906 kJ/m³
21 kJ/m³

Thermal Diffusivity

52.7 mm²/s
114.6 mm²/s

Thermal Shock Resistance Index

51
44

Strength versus weight

Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleCu-ETP1C82000

Manufacturing and finishing

CapabilityC82000Cu-ETP1
Default condition——
Relative cost$$$$ High$$$$ High
Min. machined wall——
Best machined surface——

Both take the same 4 finishes: Copper Plating, Electroless Nickel (EN), Gold Plating, Silver Plating.

C82000 vs Cu-ETP1 — frequently asked

Is C82000 stronger than Cu-ETP1?

Yes. C82000 has a typical yield strength of 500 MPa (72.5 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1 — about 7.1 times as much. Tensile strength is 655 MPa (95 ksi) vs 220 MPa (31.9 ksi).

Which is cheaper, C82000 or Cu-ETP1?

Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.

Which is easier to machine, C82000 or Cu-ETP1?

Cu-ETP1, by a small margin. Both rate poor for machinability — 30/100 against 25/100 for C82000; for welding the order is Cu-ETP1 first (fair, 50/100) then C82000 (fair, 40/100).

Ready to make it?

Upload a CAD file and FabDigit prices the part in C82000 and Cu-ETP1 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.